Chinese researchers have recently achieved a significant breakthrough by developing a novel method for mass-producing two-dimensional (2D) semiconductor wafers, which could transform the landscape of high-performance electronics. As the semiconductor industry progresses, traditional silicon technology is nearing its physical limits, necessitating the exploration of alternative materials that can outperform existing technologies. With transistors shrinking in size, the need for next-generation materials has become a global focus, and 2D materials like molybdenum disulfide (MoS₂) are seen as potentially groundbreaking.