China is making significant strides in its semiconductor manufacturing capabilities, particularly in the area of photoresist materials, which are crucial for processes like photolithography. During the recent annual political gathering known as the “two sessions,” a prominent Chinese supplier announced ambitious plans to achieve mass production of core photoresist materials within five years. The focus is on creating advanced types such as KrF, ArF, and EUV, which are essential for cutting-edge chip manufacturing processes.

The shift towards domestic production of photoresist reflects a broader strategy to overcome the reliance on foreign technologies and suppliers, particularly from the United States and Japan, who have historically dominated this sector. As outlined by Fu, a deputy to the National People’s Congress, the transition from “single-point breakthroughs” to a more comprehensive